1. product profile 1.1 general description high-speed switching diode fabricated in planar technology, and encapsulated in a small hermetically sealed glass sod80c surface-mounted device (smd) package. 1.2 features and benefits ? high switching speed: max. 4 ns ? general application ? reverse voltage: max. 50 v ? repetitive peak reverse voltage: max. 75 v ? repetitive peak forward current: max. 450 ma ? small hermetically seal ed glass smd package 1.3 applications ? high-speed switching ? military and industrial applications 1.4 quick reference data [1] device mounted on an fr4 printed-circuit board (pcb). 2. pinning information [1] the marking band indicates the cathode. PMLL4153 high-speed diode rev. 3 ? 19 august 2010 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit i f forward current [1] --200ma v r reverse voltage - - 50 v v f forward voltage i f =50ma 740 - 880 mv table 2. pinning pin description simplified outline graphic symbol 1 cathode [1] 2 anode ka 006aab04 0 2 1
PMLL4153 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 19 august 2010 2 of 10 nxp semiconductors PMLL4153 high-speed diode 3. ordering information 4. marking 5. limiting values [1] device mounted on an fr4 pcb. [2] t j =25 c prior to surge. 6. thermal characteristics [1] device mounted on an fr4 pcb. table 3. ordering information type number package name description version PMLL4153 - hermetically sealed glass surface-mounted package; 2 connectors sod80c table 4. marking codes type number marking code PMLL4153 marking band table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v rrm repetitive peak reverse voltage -75v v r reverse voltage - 50 v i f forward current [1] -200ma i frm repetitive peak forward current -450ma i fsm non-repetitive peak forward current square wave [2] t p =1 s-4a t p =1ms - 1 a t p =1s - 0.5 a p tot total power dissipation t amb 25 c [1] -500mw t j junction temperature - 200 c t stg storage temperature ? 65 +200 c table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-t) thermal resistance from junction to tie-point - - 300 k/w r th(j-a) thermal resistance from junction to ambient in free air [1] - - 350 k/w
PMLL4153 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 19 august 2010 3 of 10 nxp semiconductors PMLL4153 high-speed diode 7. characteristics [1] when switched from i f = 10 ma to i r =10ma; r l = 100 ; measured at i r =1ma. [2] when switched from i f = 10 ma to i r =60ma; r l = 100 ; measured at i r =1ma. [3] when switched to i f = 200 ma; t r = 0.4 ns; measured at v f =1v. table 7. characteristics t j =25 c unless otherwise specified. symbol parameter conditions min typ max unit v f forward voltage i f = 0.1 ma 490 - 550 mv i f = 0.25 ma 530 - 590 mv i f = 1 ma 590 - 670 mv i f = 2 ma 620 - 700 mv i f = 10 ma 700 - 810 mv i f = 50 ma 740 - 880 mv i r reverse current v r =50v --0.05 a v r =50v; t j = 150 c --50 a c d diode capacitance v r =0v; f=1mhz --2pf t rr reverse recovery time [1] --4ns [2] --2ns t fr forward recovery time [3] --10ns device mounted on an fr4 printed-circuit board (pcb). (1) t j = 175 c; typical values (2) t j =25 c; typical values (3) t j =25 c; maximum values fig 1. forward current as a function of ambient temperature; derating curve fig 2. forward current as a function of forward voltage 0 100 200 300 200 0 100 mbg451 t amb ( c) i f (ma) 012 600 0 200 400 mbg464 v f (v) i f (ma) (1) (2) (3)
PMLL4153 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 19 august 2010 4 of 10 nxp semiconductors PMLL4153 high-speed diode based on square wave currents. t j =25 c prior to surge fig 3. non-repetitive peak forward current as a function of pulse duration; maximum values (1) v r = 75 v; maximum values (2) v r = 75 v; typical values (3) v r = 20 v; typical values f=1mhz; t j =25 c fig 4. reverse current as a function of junction temperature fig 5. diode capacitance as a function of reverse voltage; typical values mbg704 10 1 10 2 i fsm (a) 10 ? 1 t p ( s) 110 4 10 3 10 10 2 0 100 t j ( c) 200 10 3 10 2 10 ? 1 10 ? 2 10 (1) (2) 1 i r ( a) mgd006 (3) 01020 1.2 1.0 0.6 0.4 0.8 mgd004 v r (v) c d (pf)
PMLL4153 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 19 august 2010 5 of 10 nxp semiconductors PMLL4153 high-speed diode 8. test information 9. package outline fig 6. reverse recovery voltage test circuit and waveforms input signal: forward pulse rise time t r = 0.4 ns; forward pulse duration t p = 100 ns; duty factor =0.01 fig 7. forward recovery time test circuit and waveforms t rr (1) + i f t output signal t r t p t 10 % 90 % v r input signal v = v r + i f r s r s = 50 i f d.u.t. r i = 50 sampling oscilloscope mga881 t r t t p 10% 90% i input signal r s = 50 i r i = 50 oscilloscope 1 k 450 d.u.t. mbh181 v fr t fr t output signal v f (v) 1.0 fig 8. package outline sod80c 06-03-16 dimensions in mm 1.60 1.45 0.3 3.7 3.3 0.3
PMLL4153 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 19 august 2010 6 of 10 nxp semiconductors PMLL4153 high-speed diode 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . 11. soldering table 8. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 2500 10000 PMLL4153 sod80c 4 mm pitch, 8 mm tape and reel -115 -135 fig 9. reflow soldering footprint sod80c fig 10. wave soldering footprint sod80c sod080c 2.30 4.30 4.55 1.60 1.70 2.25 0.90 (2x) solder lands solder resist occupied area solder paste dimensions in mm sod080c 2.70 4.90 6.30 1.70 2.90 1.90 solder lands tracks solder resist occupied area dimensions in mm
PMLL4153 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 19 august 2010 7 of 10 nxp semiconductors PMLL4153 high-speed diode 12. revision history table 9. revision history document id release date data sheet status change notice supersedes PMLL4153 v.3 20100819 product data sheet - pmll4150_2 modifications: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? type numbers pmll4150 and pmll4151 removed. ? legal texts have been adapted to the new company name where appropriate. ? table 1 ? quick reference data ? : added ? section 4 ? marking ? : added ? figure 1 : updated ? figure 8 : superseded by minimized package outline drawing ? section 10 ? packing information ? : added ? section 11 ? soldering ? : added ? section 13 ? legal information ? : updated pmll4150_2 19960918 product specification - pmll4150_1 pmll4150_1 19960423 product specification - -
PMLL4153 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 19 august 2010 8 of 10 nxp semiconductors PMLL4153 high-speed diode 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
PMLL4153 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 3 ? 19 august 2010 9 of 10 nxp semiconductors PMLL4153 high-speed diode quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors PMLL4153 high-speed diode ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 19 august 2010 document identifier: PMLL4153 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics . . . . . . . . . . . . . . . . . . 2 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 packing information . . . . . . . . . . . . . . . . . . . . . 6 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 legal information. . . . . . . . . . . . . . . . . . . . . . . . 8 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 contact information. . . . . . . . . . . . . . . . . . . . . . 9 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
|
